Inspection Systems
3D AOI
A high speed CMOS Camera with Dual Laser Technology, RGB Led lights, Telecentric lens, Light weight, Compact sensor head design industry leading Inspection Speed: 65 cm2/sec @ 14 x 14um. Cycle Time: For PCB 260mm x 200mm = 10 seconds including load and unload
3D SPI
A 3D solder paste inspection machine with exclusive of dual laser technology to eliminate shadow using RSC-7. Brings solder paste inspection to a whole new level. Featuring an a expansive application range, high, repeatability, accuracy and speed. Capable of measuring height, area volume and BLT
X-RAY INSPECTION
Available in 100KV 5um, 130KV 3um X-ray tube; Available with Image intensifier with 2mp CCD camera, FPD simultaneously tilt ±35°; Automatic lifting & descending, Programmable detection, Multi function DXI image processing system; Available in 6 axis linkage, 360 degree detection; Available in AXI, stand alone, bench top systems.
3D AOI Scan
CSAM Scan
3D SPI Scan
X-ray Inspection
Notice: Image may differ from actual unit.