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DAGE PC2400 BONDTESTER / SHEAR / WIREPULL Machine is a widely used testing equipment in the Semiconductor Assembly Industry for die / BGA ball shear / wirebond ball / wirebond pull test / bump pull and shear / lead fatigue test and more. Refurbished, Used, Spare Parts and Service Support provided.
 

 
Asymtek DispenseMate 550 utilizes company's FluidMove? for Windows? NT software. Flexible architecture provides portability to develop programs off-line that can be transferred to other sites or moved to in-line systems. CAD import software and Automatic Pattern Recognition are also available. Two models are available, 555 and 553, with dispense areas of 20.7 x 20.7 in. and 12.8 x 12.8 in. Small footprint suits batch-dispensing applications.
 
  CR Technology’s Inline AOI with three cameras small medium and large field of view's for PCB inspection on part orientation, location, solder defects, skew, presence.
 
 
 
 


VGA Flexi-vision Inspection
FlexiVision is carefully designed to meet these demand by taking advantage of the latest developments in computer technology and ergonomic machine design. The system lets you have the strength of a Profile Projection, Toolmaker Microscope and contact type CMM. X-Y measuring range from 50 x 50mm to 1m x 1m;
 
The YESTECH M1 AOI Demo Machine uses advanced Thin Camera technology that offers high-speed PCB inspection with exceptional defect coverage. With three megapixel resolution and telecentric optics, M1 Series inspects solder joints and verifies correct part assembly, all within a footprint less than 1 meter wide, enabling users to improve quality and increase throughput. the M1 Series is equally effective for paste, pre / post-reflow or final assembly inspection.
FUJI PREHEATERS
Roller Electrode type This type uses special rotating electrode, achieving highly efficient heating. The roller pitch adjustment enables optimum and external temperature distribution in the preformed resin.
Hood safety device, automatic high tension grounding and hood closing interlock.
KAIJO WIREBONDER
Manufacturer: Kaijo
Model: FB118C
Serial no: 1001
Description: Hybrid Ball Bonder
Details Mag to Mag

 

The CR Technology CRX-1000 and CRX-2000 was the leading industrial x-ray for Semiconductor, Electronics and Automotive applications until it was bought over by Photon Dynamics Inc. in the wake of the Semicon slowdown. Still a functional tool for production and laboratory use. We provide refurbished machine, hard to find spare parts, fabricate and rehabilitation and upggrade services for old x-ray systems.
 

Parmi SPI 2500

The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy.


The MANNCORP 330 benchtop reflow oven for SMT soldering and curing operations combines four individually controlled heating zones (three top, one bottom) with a 34"-long heating tunnel to guarantee accurate, repeatable temperature profiles across the assembly. Reflow assemblies up to 12" (300mm) wide with hot air/convection heating in the upper zones. For the best performance and reliablity, an aluminous plate heater is installed in the lower zone. Simple, built-in controls make setting up for your job a breeze
Auto Trim/Form/Sing System,
Major Specification.
Motor & Pulley-Belt with eccentric CAM Shaft Press Tonnage: 3ton or 5ton, Magazine On loading/ Magazine or Tube Offloading , PLC Control With P>C Touch Screen & Ten Key, SPM: 100~200 (Depends on Package Type & design) no Chip –out, no scratch, no Visual Crack or micro crack, no dent or Damaged lead